MG Chemicals 8329TCS-50ML, Thermal Adhesive-High TC, 50ml Jar, Case of 6

This high thermal conductivity adhesive paste is a 2-part epoxy with a long 4-hour working time. It is dark grey, smooth, viscous, thixotropic, and bonds well to a wide variety of substrates.

Use this thermal adhesive paste to glue heat sinks to LEDs, CPUs, and other heat-generating components. This product is highly viscous and must be mixed by hand prior to application. We also offer a lower viscosity alternative (8329TFS) suitable for use with mixing tips.

• Thermal conductivity of 1.4 W/(m·K)
• 1:1 mix ratio
• Working time: 4 hours
• Cure time: 1 hour at 80 °C (176 °F)
• Provides strong electrical insulation
• High tensile strength
• Strong resistance to humidity, salt water, mild bases, and aliphatic hydrocarbons
• NASA low outgassing approved

Technical Data Sheet

Safety Data Sheet