NC-SMQ®92J is a halogen-free, air reflow, no-clean solder paste formulated to leave a benign, probe-testable residue. The residue is easily penetrated and will not clog multi-point probes. This product has other qualities such as consistent fine-pitch paste deposition, unsurpassed stencil life and tack time, and excellent wetting. NC-SMQ92J will perform well on high speed surface mount lines utilizing fast print speeds and rapid chip placement. NC-SMQ92J meets or surpasses all ANSI/J-STD-004, -005 specifications and Bellcore test criteria.
• Excellent wetting reflow in air
• Probe-testable residue
• Extended open time
• Consistent fine-pitch printing
• Strong initial tack strength and long-term stability
• High humidity resistance
Standard packaging for stencil printing applications includes 4 oz. jars and 6 oz. or 12 oz. cartridges. Packaging for enclosed print head systems is also readily available. For dispensing applications, 10cc and 30cc syringes are standard. Other packaging options are available on request.
*required to ship Air when ground option is more than 1 day