All About That Solder Paste
Solder Features & Benefits
Soldering is a process that creates electrical, mechanical, or thermal bonds using heat, filler material, and flux. The heat reflows the filler material and the flux cleans the oxides off the surfaces that will be joined together. Once the heat is removed, the solder solidifies to create a bond. Although this sounds simple, there are many things to consider when choosing the right materials for your process.
Indium Corporation’s high quality solder pastes are uniquely formulated for superior performance to satisfy a variety of assembly requirements.
Solder Paste Features & Benefits
Indium Corporation produces a wide range of solder paste products to fit every need and challenge in the PCB Assembly and semiconductor manufacturing market space.
No-clean solder paste is by far the most prevalent solder paste in modern electronic manufacturing, but there is still a purpose and a fit for water-soluble and RMA solder paste as well. Solder paste can be manufactured in hundreds of alloys and with powder size ranging from Type 3 to Type 8. Solder pastes are available for a wide variety of process deposition techniques, including printing, dipping, dispensing, jetting, and pin transfer assembly. Each formula is specifically designed to meet the gamut of manufacturing challenges that plague the electronics manufacturing industry. Whether you are dealing with warpage induced defects, voiding, insufficient solder paste volume, or electrical or mechanical reliability issues, Indium Corporation’s solder pastes – coupled with our world-renowned technical support – allow for the lowest total cost of ownership and fewer end-of-line defects. (Courtesy of Indium Corporation)
